Laser Soldering
How Laser Soldering Works And Why You Should Be Interested
Laser soldering is a non-contact process that eliminates the risk of marring or damaging sensitive components. Robots are capable of producing micro-sized laser beams for otherwise difficult applications too small for iron tip soldering. Our advanced optical technology provides a reliable solution for micro and narrow pitched parts used in high-density electronic equipment.
The laser soldering process depends on the type of solder to be used (wire, pre-form or paste). In the case of solder wire, laser irradiation is performed in advance to the joint area (pre-heating). This is the most important process in order to wet and allow the solder to flow easily when supplying the solder wire to the joint area.
J-CAT STAR GATE
This robot is non-contact soldering that heats up the target with a high energy light emitted from an oscillated laser diode and is focused with a lens. It is an 80Watt laser with an infrared wavelength of 925nm. The Stargate has has an infrared pyrometer option that provides real-time temperature control.
Type | MLU-808FS | MLU-980FS | ||
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Material | Semiconductor Laser |
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Oscillation | CW (Continuous Wave) |
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LD Type |
Fiber Coupling |
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LD Output |
50W | |||
Wavelength | 808 nm |
980 nm |
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Guide Beam |
Included | |||
Halation Prevention |
Included | |||
LD Cooling System |
Electric Cooling |
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Coaxial Observation Function |
Included | |||
Fiber Core Diameter |
φ200μm |
φ400μm | ||
Fiber Length |
3m | |||
Focused Beam Diameter |
φ50μm~8000μm | |||
Focal Length |
10mm ~ 200 mm (actual focal length may vary based upon beam diameter.) |
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Focused Beam Shape |
Circular, rectangular, or free shape option via SLIT laser |
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Temperature Control |
Available | |||
Parameter Control Mode |
Time | Setting Resolution |
0.1 sec |
0.01 sec |
STEP |
1~100 STEP |
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Time Setting |
1 STEP = 0.1 sec. (Max: 0.1sec. ×100STEP = 10sec.) | |||
Current (A) Control |
Setting Resolution |
0.1A | ||
Registered Waveform Capacity |
16 | |||
Interface | Input Terminal x 1; Sig. OUT (BNC) x 1; CURR. MINI (BNC) x 1; RS232 x 1; Analog Input (0~5V) x 1 |
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Dimensions WxDxH |
Laser Head |
160.5 x 114 x 366 mm (Max size) |
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Laser Oscillation Unit |
270 x 260 x 230 mm |
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Laser Controller |
430 x 350 x 149 mm |
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Weight | Laser Head |
Approx 1 kg |
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Laser Oscillation Unit |
Approx 6.5 kg |
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Laser Controller |
Approx 16 kg |
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Power | Single Phase AC100V |
AC220V ± 10% 50/60 Hz |
Solder Paste Dispensers
Achieve ultimate small volume stability with precision nozzels. Dispensing technology provides an alternative to the classic wire feed approach. Dispensers allow for a precise amount of solder paste to be evenly distributed in micro amounts. This approach eliminates waste and increases cost effectiveness.
Lenses
The type of lens to form a laser beam is composed of two components, the “Input lens” and “Output lens”. With the combination of these lenses, over 100 diameter variations can be achieved.