Laser Soldering
How Laser Soldering Works And Why You Should Be Interested
Laser soldering is a non-contact process that eliminates the risk of marring or damaging sensitive components. Robots are capable of producing micro-sized laser beams for otherwise difficult applications too small for iron tip soldering. Our advanced optical technology provides a reliable solution for micro and narrow pitched parts used in high-density electronic equipment.
The laser soldering process depends on the type of solder to be used (wire, pre-form or paste). In the case of solder wire, laser irradiation is performed in advance to the joint area (pre-heating). This is the most important process in order to wet and allow the solder to flow easily when supplying the solder wire to the joint area.
J-CAT MLU-808FS/ MLU-980FS
Our Desktop Laser-Soldering Robot
This robot is non-contact soldering that heats up the target with a high energy light emitted from an oscillated laser diode and is focused with a lens. Wavelength can be either 808nm or 980nm, varying between models. Featuring 50 and 100 watt options.
Type | MLU-808FS | MLU-980FS | ||
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Material | Semiconductor Laser |
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Oscillation | CW (Continuous Wave) |
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LD Type |
Fiber Coupling |
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LD Output |
50W | |||
Wavelength | 808 nm |
980 nm |
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Guide Beam |
Included | |||
Halation Prevention |
Included | |||
LD Cooling System |
Electric Cooling |
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Coaxial Observation Function |
Included | |||
Fiber Core Diameter |
φ200μm |
φ400μm | ||
Fiber Length |
3m | |||
Focused Beam Diameter |
φ50μm~8000μm | |||
Focal Length |
10mm ~ 200 mm (actual focal length may vary based upon beam diameter.) |
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Focused Beam Shape |
Circular, rectangular, or free shape option via SLIT laser |
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Temperature Control |
Available | |||
Parameter Control Mode |
Time | Setting Resolution |
0.1 sec |
0.01 sec |
STEP |
1~100 STEP |
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Time Setting |
1 STEP = 0.1 sec. (Max: 0.1sec. ×100STEP = 10sec.) | |||
Current (A) Control |
Setting Resolution |
0.1A | ||
Registered Waveform Capacity |
16 | |||
Interface | Input Terminal x 1; Sig. OUT (BNC) x 1; CURR. MINI (BNC) x 1; RS232 x 1; Analog Input (0~5V) x 1 |
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Dimensions WxDxH |
Laser Head |
160.5 x 114 x 366 mm (Max size) |
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Laser Oscillation Unit |
270 x 260 x 230 mm |
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Laser Controller |
430 x 350 x 149 mm |
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Weight | Laser Head |
Approx 1 kg |
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Laser Oscillation Unit |
Approx 6.5 kg |
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Laser Controller |
Approx 16 kg |
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Power | Single Phase AC100V |
AC220V ± 10% 50/60 Hz |
Slit Beam: Laser-Shaping Technology Option
Although the laser beam shape is generally circular, this originally developed SLIT plate (metal plate with a hole) enables virtually any type of laser beam shape. Since the beam shape can be conformed to the part shape, damage to adjacent parts is greatly reduced.
Solder Paste Dispensers
Achieve ultimate small volume stability with precision nozzels. Dispensing technology provides an alternative to the classic wire feed approach. Dispensers allow for a precise amount of solder paste to be evenly distributed in micro amounts. This approach eliminates waste and increases cost effectiveness.
Lenses
The type of lens to form a laser beam is composed of two components, the “Input lens” and “Output lens”. With the combination of these lenses, over 100 diameter variations can be achieved.
The TCU-1000 Optional Unit
This non-contact radiation thermometer measures the temperature of the soldering point in real time. Select it from the accessories listing below to learn more about how it can keep your laser machine stable.